言語を選択
×
English
العربية
Azərbaycan
Bosna
Български език
Беларусь
čeština
Deutsch
Eesti Vabariik
español
فارسی
Suomi
Français
Ελλάδα
日本語
Magyarország
Gaeilge
हिंदी
íslenska
Italia
עִבְרִית
한국의
lietuvių
Lëtzebuergesch
Latviešu
Melayu
Nederland
Kongeriket
Maori
polski
Português
românesc
Cрпски
русский
Svenska
Slovenija
Slovenská
Dansk
Català
Corsa
Hrvatska
Indonesia
简体中文
Afrikaans
አማርኛ
বাংলা ভাষার
Euskera
Galego
ગુજરાતી
Hausa
Ayiti
საქართველო
Қазақша
Cambodia
ಕನ್ನಡkannaḍa
Kurdî
Кыргыз тили
ພາສາລາວ
malaɡasʲ
Македонски
Монголулс
मराठी
မြန်မာ
नेपाली
Chicheŵa
پښتو
සිංහල
Republika e Shqipërisë
Sesotho
Kiswahili
தமிழ் மொழி
తెలుగు
Тоҷикӣ
ภาษาไทย
Pilipino
УКРАЇНА
اردو
O'zbek
tiếng Việt
IsiXhosa
メニューを展開する
言語
0
フロントページ
製品
メーカー
ブログ
見積もりを取得
私たちについて
会社概要
サプライチェーンマネジメント
品質管理
余剰資材の管理
サービスと保証
お問い合わせ
ホーム
ブログ
China’s power crunch affects semiconductor companies with local facilities
China’s energy crisis has had a negative impact on firms that maintain component factories and chip packaging facilities in the region.
2022-04-15
TSMC to build $8.8B chip plant in Japan with government support
TSMC will construct an $8.8 billion chip factory in Japan. However, its capacity expansion will likely increase components costs industrywide.
2022-04-03
Chip lead times reach 22 weeks following Chinese power cutbacks
The average lead time for microchips has risen to 22 weeks, a new record and up nine weeks from the same time last year.
2022-01-20
Oppo designing 3nm smartphone chipsets in-house, TSMC handling production
Oppo, a leading Chinese smartphone maker, reportedly plans to release self-designed 3nm SoCs for its future handsets.
2021-12-27
Worsening ABF substrate shortfall could extend global chip shortage beyond 2023
A shortage of ABF substrate, a key semiconductor material, could extend the global chip crisis past 2023.
2021-06-15
Samsung to triple production capacity by 2026 amid rising demand
Samsung announces plans to triple its current production capacity by 2026 amid high demand for its services.
2022-04-08
Texas Instruments to build 300mm multi-fab complex in home state next year
Texas Instruments is establishing a sprawling 300mm chip manufacturing facility containing four fabs for around $30 billion in its home state.
2021-08-29
«
1
2
3
4
5
»
ブログのタグ
520
18650 battery
BAS
DRIVER
2N7002ET1G
OSC
STMicroelectronics
BC846B
CYPD2119
TAJ
STM32F103RET6
18650
M4T32
vs
Yageo
Infineon
Adesto
SN75
2N3904
74HC02D
SPC58EC70E3
1N4007
FDD5614P
BC548
Bel Fuse
74LS08
AM
Display
L7805ABV
Diagram
MPSA44
UA78
TNY
DC-DC
SS34
Random
MSP430F135IPMR
SN65HV
4CH
Read
Copyright © 2024 ZHONG HAI SHENG TECHNOLOGY LIMITED All Rights Reserved.
プライバシーに関する声明
|
利用規約
|
品質保証
Top